Stress analysis of porous rooted dental implants

A model based on a continuously bonded interface predicts high punching stresses at the apex of the implant and low stresses in the cortical plates. A model based on a continuously bonded interface predicts high stiffness and a resultant low implant displacement-load ratio. A model based on a tissue ingrowth-bonded interface predicts uniform distribution of stresses around the implant through the cortical plates. A model based on a tissue ingrowth-bonded interface predicts an implant displacement-load ratio close to the ratio measured with actual implant specimens.