Related Experiment Videos
High-frequency ultrasonic wire bonding systems
1Faculty of Engineering, Kanagawa University, Yokohama, Japan. tsujino@cc.kanagawa-u.ac.jp
Ultrasonics
|June 1, 2000
Summary
This study explores high-frequency vibration systems for ultrasonic wire bonding in electronics. Researchers developed a compact, lightweight system capable of multiple resonance frequencies for advanced semiconductor packaging.
Area of Science:
- Materials Science
- Mechanical Engineering
- Electrical Engineering
Background:
- Ultrasonic wire bonding is crucial for microelectronics assembly, including integrated circuits (IC) and large-scale integration (LSI).
- Existing systems face limitations in achieving the high frequencies required for advanced bonding techniques like face-down and flip-chip bonding.
- Optimizing vibration characteristics is key to enhancing welding efficiency and reliability in electronic device packaging.
Purpose of the Study:
- To investigate the vibration characteristics of longitudinal-complex transverse vibration systems.
- To explore the application of these systems in ultrasonic wire bonding for electronic devices.
- To develop a high-frequency, compact, and lightweight vibration system for semiconductor packaging.
Main Methods:
- Characterization of longitudinal-complex transverse vibration systems operating at multiple resonance frequencies (350-980 kHz).
- Design and fabrication of a bonding system comprising a complex transverse vibration rod, longitudinal transducers, and a transverse vibration welding tip.
- Measurement of vibration distributions along ceramic and stainless-steel welding tips up to 980 kHz.
Main Results:
- Successful development of a longitudinal-complex transverse vibration system with multiple resonance frequencies.
- Demonstration of the system's applicability for direct welding of semiconductor tips (face-down bonding, flip-chip bonding) and electronic device packaging.
- Achieved a high-frequency vibration system with dimensions of 20.7 mm height and a weight under 15 g.
Conclusions:
- The developed longitudinal-complex transverse vibration system exhibits suitable characteristics for high-frequency ultrasonic wire bonding.
- The compact and lightweight design facilitates integration into advanced semiconductor manufacturing processes.
- This technology holds potential for improving the efficiency and reliability of electronic device packaging and assembly.