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Related Experiment Videos

High-frequency ultrasonic wire bonding systems

Tsujino1, Yoshihara, Sano

  • 1Faculty of Engineering, Kanagawa University, Yokohama, Japan. tsujino@cc.kanagawa-u.ac.jp

Ultrasonics
|June 1, 2000
PubMed
Summary

This study explores high-frequency vibration systems for ultrasonic wire bonding in electronics. Researchers developed a compact, lightweight system capable of multiple resonance frequencies for advanced semiconductor packaging.

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Area of Science:

  • Materials Science
  • Mechanical Engineering
  • Electrical Engineering

Background:

  • Ultrasonic wire bonding is crucial for microelectronics assembly, including integrated circuits (IC) and large-scale integration (LSI).
  • Existing systems face limitations in achieving the high frequencies required for advanced bonding techniques like face-down and flip-chip bonding.
  • Optimizing vibration characteristics is key to enhancing welding efficiency and reliability in electronic device packaging.

Purpose of the Study:

  • To investigate the vibration characteristics of longitudinal-complex transverse vibration systems.
  • To explore the application of these systems in ultrasonic wire bonding for electronic devices.
  • To develop a high-frequency, compact, and lightweight vibration system for semiconductor packaging.

Main Methods:

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  • Characterization of longitudinal-complex transverse vibration systems operating at multiple resonance frequencies (350-980 kHz).
  • Design and fabrication of a bonding system comprising a complex transverse vibration rod, longitudinal transducers, and a transverse vibration welding tip.
  • Measurement of vibration distributions along ceramic and stainless-steel welding tips up to 980 kHz.

Main Results:

  • Successful development of a longitudinal-complex transverse vibration system with multiple resonance frequencies.
  • Demonstration of the system's applicability for direct welding of semiconductor tips (face-down bonding, flip-chip bonding) and electronic device packaging.
  • Achieved a high-frequency vibration system with dimensions of 20.7 mm height and a weight under 15 g.

Conclusions:

  • The developed longitudinal-complex transverse vibration system exhibits suitable characteristics for high-frequency ultrasonic wire bonding.
  • The compact and lightweight design facilitates integration into advanced semiconductor manufacturing processes.
  • This technology holds potential for improving the efficiency and reliability of electronic device packaging and assembly.