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A micromachined silicon depth probe for multichannel neural recording
T H Yoon1, E J Hwang, D Y Shin
1Inter-university Semiconductor Research Center, Seoul National University, Korea.
IEEE Transactions on Bio-Medical Engineering
|August 16, 2000
Summary
This study introduces a novel silicon depth-probe microelectrode array fabricated using plasma and wet etching. The process allows tunable probe thickness and mechanical strength, ensuring compatibility with CMOS fabrication and achieving high-quality neural recordings.
Area of Science:
- Neuroscience
- Materials Science
- Electrical Engineering
Background:
- Microelectrode arrays are crucial for neural recording.
- Existing fabrication methods may have limitations in controlling probe dimensions and mechanical properties.
- Compatibility with standard semiconductor fabrication processes is desirable for scalability.
Purpose of the Study:
- To develop a new fabrication process for silicon depth-probe microelectrode arrays.
- To enable precise control over probe thickness and mechanical strength.
- To demonstrate the performance of the fabricated probes in neural recordings.
Main Methods:
- Utilized a combination of plasma and wet etching techniques.
- Employed a low temperature oxide (LTO) mask for controlled plasma etching.
- Fabrication process performed at low temperatures, compatible with CMOS standards.
Main Results:
- Achieved controlled probe thickness ranging from 5 to 90 micrometers.
- Demonstrated that shank thickness directly influences mechanical strength and flexibility.
- Obtained four-channel simultaneous recordings from rat somatosensory cortex with independent channels and good signal-to-noise ratio.
Conclusions:
- The developed fabrication process offers tunable mechanical properties for microelectrode probes.
- The low-temperature, CMOS-compatible process is suitable for advanced neural interface development.
- The microelectrode arrays exhibit high performance for neural recording applications.