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Convective terms and transversely driven charge-density waves

Artemenko1, Zaitsev-Zotov, Minakova

  • 1Institute for Radioengineering and Electronics of Russian Academy of Sciences, Mokhovaya 11, 103907 Moscow, Russia.

Physical Review Letters
|September 16, 2000
PubMed
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We investigated charge-density wave (CDW) dynamics under transverse currents. Our findings show the effect is much smaller than predicted, with opposing forces from different quasiparticles, and highlight potential geometry mimics.

Area of Science:

  • Condensed Matter Physics
  • Solid State Physics
  • Materials Science

Background:

  • Charge-density waves (CDWs) are fundamental condensed matter phenomena.
  • Understanding CDW dynamics is crucial for electronic device applications.
  • Previous theories predicted significant effects of transverse currents on CDW motion.

Purpose of the Study:

  • To derive convective terms influencing moving charge-density wave (CDW) structure.
  • To investigate the impact of transverse currents on CDW dynamics along conducting chains.
  • To contrast findings with recent predictions and clarify the magnitude and direction of forces.

Main Methods:

  • Theoretical derivation of convective terms in CDW damping.
  • Analysis of CDW dynamics under transverse current flow.

Related Experiment Videos

  • Experimental investigation and demonstration of geometric effects.
  • Main Results:

    • The effect of transverse currents on CDW dynamics is orders of magnitude smaller than predicted.
    • Electron- and holelike quasiparticle contributions to transverse currents exert opposing forces on the CDW.
    • Experimental evidence suggests geometry effects can mimic the transverse current effect.

    Conclusions:

    • Transverse currents have a minimal impact on CDW dynamics compared to previous predictions.
    • The opposing forces from different quasiparticle types are a key factor in CDW response.
    • Careful experimental design is needed to distinguish true transverse current effects from geometric artifacts.