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Reducing chemical vapour infiltration time for ceramic matrix composites.

L. A. Timms1, W. Westby, C. Prentice

  • 1Mechanical Sciences Sector, Building A7, Room 2008, DERA Farnborough, Hampshire, GU14 0LX, U.K.; School of Mechanical, Materials, Manufacturing Engineering and Management, University of Nottingham, Nottinghamshire, NG7 2RD U.K.; Department of Materials Engineering, Brunel University, Middlesex, UB8 3PH, U.K.

Journal of Microscopy
|February 24, 2001
PubMed
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Microstructural analysis of silicon carbide monofilaments.

Journal of microscopyยท2001
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This study explores microwave-enhanced chemical vapour infiltration (MECVI) for producing silicon carbide ceramic matrix composites (SiCf/SiC). Pre-infiltration techniques significantly reduce processing time and cost while enhancing initial density.

Area of Science:

  • Materials Science
  • Ceramic Matrix Composites

Background:

  • Conventional ceramic matrix composite (CMC) production uses high sintering temperatures, often exceeding fiber limits.
  • Chemical vapour infiltration (CVI) offers lower processing temperatures but can be time-consuming and costly.

Purpose of the Study:

  • To investigate modified CVI methods for producing SiCf/SiC composites.
  • To reduce the processing time and cost of CVI for SiCf/SiC.
  • To avoid fiber degradation during CMC production.

Main Methods:

  • Microwave-enhanced CVI (MECVI) was employed.
  • Electrophoretic infiltration and vacuum bagging were used as pre-infiltration steps.
  • Dual energy X-ray absorptiometry evaluated material density.

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Main Results:

  • Both pre-infiltration methods enhanced initial density.
  • Significant reductions in MECVI processing time were achieved.
  • The presence of SiC powder in the pre-form influenced the deposition profile.

Conclusions:

  • Modified MECVI with pre-infiltration is effective for SiCf/SiC production.
  • These methods offer a faster, potentially cheaper alternative to conventional CVI.
  • Further investigation into deposition profile changes is warranted.