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Development of the line-focus-beam ultrasonic material characterization system
Jun-ichi Kushibiki1, Yuu Ono, Yuji Ohashi
1Department of Electrical Engineering, Tohoku University, Sendai, Japan. kushi@ecei.tohoku.ac.jp
Summary
A new line-focus-beam ultrasonic material characterization (LFB-UMC) system precisely evaluates electronic crystals and wafers. This advanced system achieves high accuracy for material property detection in large diameter substrates.
Area of Science:
- Materials Science
- Physics
- Engineering
Background:
- Electronic devices rely on large diameter crystals and wafers.
- Accurate characterization of material properties is crucial for device performance and fabrication.
- Existing methods may lack the precision needed for detecting subtle property variations.
Purpose of the Study:
- To develop a highly accurate line-focus-beam ultrasonic material characterization (LFB-UMC) system.
- To enable precise evaluation of physical and chemical properties in large diameter crystals and wafers.
- To improve measurement accuracy for material characterization in electronic device applications.
Main Methods:
- Utilizing Rayleigh-type leaky surface acoustic waves (LSAWs) excited on water-loaded specimens.
- Measuring LSAW propagation characteristics, including phase velocity and attenuation.
- Implementing new precision mechanical translation stages and a temperature-controlled chamber.
- Developing a method for precise temperature and longitudinal velocity measurement in water couplant.
Main Results:
- Achieved relative accuracy better than +/- 0.002% for single-point measurements.
- Attained +/- 0.004% accuracy for two-dimensional measurements over a 200-mm diameter area.
- Significantly reduced errors from mechanical translation and thermal variations.
- Demonstrated capability for highly accurate detection of slight changes in material properties.
Conclusions:
- The developed LFB-UMC system offers unprecedented accuracy for characterizing large diameter crystals and wafers.
- This system addresses critical challenges in materials development and device fabrication.
- The enhanced precision facilitates advancements in electronic device manufacturing and material science research.