Complex vibration ultrasonic welding systems with large area welding tips

Area of Science:

• Materials Science
• Mechanical Engineering
• Manufacturing Technology

Background:

• Ultrasonic welding is a key technology for joining materials, especially in electronics and advanced manufacturing.
• Traditional ultrasonic systems often face limitations with diverse material combinations and complex joint geometries.
• The development of advanced vibration modes is crucial for expanding the applicability of ultrasonic welding.

Purpose of the Study:

• To investigate the vibration and welding characteristics of complex vibration ultrasonic welding systems.
• To evaluate the effectiveness of these systems for joining various metal specimens, including dissimilar metals.
• To assess the suitability for direct welding of semiconductor tips and electronic device packaging.

Main Methods:

• Utilized complex vibration systems with elliptical to circular or rectangular to square vibration loci.
• Employed a one-dimensional longitudinal-torsional vibration converter, stepped horn, and longitudinal vibration transducer.
• Tested welding of aluminum plate specimens (0.3-1.0 mm thickness) at 27 and 40 kHz frequencies.

Main Results:

• Achieved successful joining of aluminum plate specimens with weld strengths comparable to the base material.
• Demonstrated weld strength independence from specimen orientation.
• Observed that the 40 kHz system requires a smaller vibration amplitude compared to the 27 kHz system.
• Confirmed the system's capability for direct welding of semiconductor tips and electronic packaging without solder.

Conclusions:

• Complex vibration ultrasonic welding systems offer a versatile and effective method for joining various materials, including dissimilar metals.
• The developed systems are suitable for high-precision applications like semiconductor packaging.
• Optimizing frequency and vibration amplitude is key to efficient ultrasonic welding performance.