Traveling fronts of copper deposition

We report the experimental observation of traveling fronts during the electroless deposition of copper on passive steel substrates. The low-carbon steel samples are passivated in nitric acid prior to the plating experiment, thus creating a thin, protective oxide layer on the steel surface. The deposition experiments are carried out from slightly acidic (pH 3.2) copper sulfate solution and copper nitrate solution with the latter showing front propagation only in the presence of chloride ions. For up to 30 s, fronts propagate with constant velocities in the range from 0.5 to 5 mm/s depending on the experimental conditions. This phase of constant-speed propagation gives way to accelerating fronts and very rapid, spatially unstructured deposition. Front-mediated plating is observed over a wide range of cupric ion concentration and constitutes a striking and unexpected example for pattern formation in electrochemical systems.