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Microleakage of four simplified adhesive systems under thermal and mechanical stresses
Paulo Eduardo Capel Cardoso1, Eliane Placido, Sandra Kiss Moura
1Department of Dental Materials, School of Dentistry, University of São Paulo, São Paulo, Brazil. paulocapel@uol.com.br
Purpose:
To evaluate microleakage at the dentin margins of Class II resin-based composite restorations using four simplified adhesive systems: Etch & Prime 3.0, Prime & Bond NT, Clearfil Liner Bond 2V and Clearfil SE Bond, upon thermal and mechanical stresses.
Materials And Methods:
Forty slot preparations (5mm x 3mm x 1.5mm) were cut in sound human molars with gingival margins below the cement/enamel junction. All adhesive systems were applied strictly according to manufacturers' instructions. Cavities were restored using Clearfil AP-X composite resin. After finishing and polishing, teeth were submitted to thermal (x700, 5-55 degrees C, 60-second dwell time) and consecutively mechanical cycling (100,000 cycle; 8 Kgf load). Specimens were coated with nail polish, immersed in silver nitrate for 2 hours and sectioned longitudinally with a diamond disc. The extent of leakage was ranked using a 0-4 scale.
Results:
Statistical analysis was performed using Kruskal-Wallis test. Minimal leakage occurred with Clearfil SE Bond. There was a statistically significant difference (P<0.01) between this system and Clearfil Liner Bond 2V, although the latter also showed low values of dye penetration. No statistically significant difference was found between Etch & Prime 3.0 and Prime & Bond NT. Both showed statistically greater leakage than the two other systems (P<0.01).