Electrical characterization of coupled and uncoupled MEMS ultrasonic transducers

We report electrical characterization of micromachined polysilicon capacitive diaphragms for use as ultrasonic transducers. Admittance measurements yield insight into the resonant behavior and also the damping resulting from ultrasonic radiation and frictional forces caused by the etch release holes. Unbonded transducers exhibit sharp resonances with Q values that increase with decreasing air pressure. We also report for the first time direct bonding of these transducers to solid surfaces. Transducers survive the bonding process and show distinctly different displacement in response to applied dc bias. Finally, a single-degree-of-freedom model is used to obtain insight into the various contributions to damping.