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Three-dimensional Optical-resolution Photoacoustic Microscopy
Published on: May 3, 2011
Dry-contact technique for high-resolution ultrasonic imaging
Hironori Tohmyoh1, Masumi Saka
1Department of Mechanical Engineering, Tohoku University, Aramaki, Aoba-ku, Sendai 980-8579, Japan. tohmyoh@ism.mech.tohoku.ac.jp
Summary
This study introduces a novel dry-contact ultrasonic transmission method for high-resolution imaging without sample wetting. Optimal film selection enables effective high-frequency ultrasound transmission, ensuring sufficient signal-to-noise ratio for detailed analysis.
Area of Science:
- Materials Science
- Non-Destructive Testing
- Acoustics
Background:
- Traditional ultrasonic imaging often requires sample wetting, which can be impractical or undesirable.
- Achieving high-resolution imaging necessitates efficient acoustic coupling between the transducer and the sample.
Purpose of the Study:
- To investigate the efficiency of dry-contact ultrasonic transmission for high-resolution imaging.
- To develop a method for forming a dry-contact interface without wetting the sample.
- To model and assess signal loss during dry-contact ultrasonic transmission.
Main Methods:
- A dry-contact interface was created using a thin film between water and the sample.
- Air evacuation between the film and sample applied pressure to the interface.
- A transmission model was developed to evaluate signal loss.
- Various films were tested to determine optimal transmission properties.
Main Results:
- Higher frequency ultrasound was effectively transmitted into the sample by selecting an optimum film.
- The optimal film maintained displacement continuity between the film and sample.
- Successful ultrasonic imaging was achieved on package delamination and ball-grid-array interfaces.
Conclusions:
- Dry-contact ultrasonic transmission is feasible for high-resolution imaging without sample wetting.
- Film selection is critical for efficient ultrasound coupling and signal integrity.
- The developed method enables non-destructive evaluation of packaged electronic components.

