Dielectric properties of KDP filled porous alumina nanocomposite thin films

A new concept of a composite dielectric thin film fabrication is presented. The fabrication process consists of two stages. The first stage is anodizing a thin aluminum film to produce a porous alumina film that contains an array of nanometer sized parallel pores. The second stage is filling the pores with a saturated KDP (KH2PO4) liquid solution due to capillary forces. After drying KDP nanocrystals are formed inside the pores. This process results in a formation of a composite dielectric thin film composed of the alumina pores walls as one dielectric material and the KDP nanocrystals inside the pores as another dielectric material. The dielectric permittivity of this composite film is higher than that of the porous alumina film at all applied frequencies. The dielectric enhancement is more pronounced at low frequencies due to an interface polarization mechanism. This fabrication process enables controlling the size, composition, and microstructure of the composite dielectric film constituents and thus changing its dielectric properties over a wide range of values.