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Controlled core removal from a D-shaped optical fiber.

Douglas J Markos1, Benjamin L Ipson, Kevin H Smith

  • 1Department of Electrical Engineering, Brigham Young University, Provo, Utah 84602, USA.

Applied Optics
|January 14, 2004
PubMed
Summary

Researchers developed a chemical etching method to precisely remove sections of D-shaped optical fiber cores. This technique uses hydrofluoric acid to achieve repeatable control over etch depth for optical fiber fabrication.

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Area of Science:

  • Materials Science
  • Optical Engineering
  • Chemical Engineering

Background:

  • D-shaped optical fibers are crucial components in various photonic applications.
  • Precise modification of optical fiber cores is essential for advanced device fabrication.
  • Existing methods for core modification may lack repeatability or precision.

Purpose of the Study:

  • To present a novel method for the partial removal of a D-shaped optical fiber core.
  • To establish a repeatable process for achieving specific etch depths in optical fibers.
  • To correlate the chemical etching parameters with the resulting etch depth.

Main Methods:

  • Selective chemical etching using hydrofluoric (HF) acid solutions.
  • Utilizing a 25% HF solution to remove cladding material.

Related Experiment Videos

  • Employing a 5% HF solution for core material removal.
  • Monitoring the etching process with a 670 nm red laser.
  • Analyzing etch depth using scanning electron microscope (SEM) imaging.

    • Main Results:

    • Demonstrated selective removal of cladding and core materials.
    • Established a correlation between etch depth and transmitted laser power.
    • Achieved repeatable control over the etch depth of the optical fiber core.
    • Identified specific HF concentrations for cladding and core etching.

    Conclusions:

    • The developed chemical etching process offers a repeatable method for precise optical fiber core modification.
    • This technique enables the fabrication of optical fibers with controlled etch depths.
    • The correlation between laser power and etch depth provides a real-time monitoring capability.