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A three-dimensional architecture for a parallel processing photosensing array.

T Johansson1, M Abbasi, R J Huber

  • 1Department of Electrical Engineering, University of Utah, Salt Lake City 84112.

IEEE Transactions on Bio-Medical Engineering
|December 1, 1992
PubMed
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A novel 3D photosensing array architecture was created using silicon, featuring a 10x10 grid of photodiode sensors. This design enables a "silicon retina" framework for advanced optical sensing applications.

Area of Science:

  • Materials Science
  • Electrical Engineering
  • Optoelectronics

Background:

  • Traditional photosensing arrays often lack integrated 3D capabilities.
  • Developing compact and efficient photosensor architectures is crucial for advanced imaging systems.

Purpose of the Study:

  • To develop a novel three-dimensional (3D) architecture for a photosensing array.
  • To create a silicon-based framework suitable for a "silicon retina".

Main Methods:

  • Fabrication of a 10x10 array of pn-junction photodiodes on a silicon wafer.
  • Utilizing thermomigration of aluminum pads for through-chip interconnects.
  • Establishing ohmic contacts to interconnects and the substrate on the wafer's back side.

Main Results:

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  • Successful development of a 3D photosensing architecture with integrated through-chip interconnects.
  • Characterization of electrical and optical properties suitable for advanced sensing.
  • Demonstration of a 10x10 array of 80-micron diameter photosensors.

Conclusions:

  • The developed 3D photosensing architecture is a viable framework for building a "silicon retina".
  • The fabrication process and resulting characteristics support potential applications in advanced optical sensing.