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Related Experiment Videos

Accurate calibration of TXRF using microdroplet samples.

L Fabry1, S Pahlke, L Kotz

  • 1Wacker Chemitronic GmbH, D-84489, Burghausen, Germany.

Analytical and Bioanalytical Chemistry
|January 1, 1996
PubMed
Summary

Total reflection X-ray fluorescence (TXRF) combined with vapor phase decomposition (VPD) accurately detects trace impurities on silicon wafer surfaces. Calibration using microdroplet standards ensures high-confidence quantification for semiconductor manufacturing.

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Area of Science:

  • Materials Science and Engineering
  • Analytical Chemistry
  • Semiconductor Physics

Background:

  • Accurate analysis of trace impurities in silicon wafer native oxide layers is critical for semiconductor device performance.
  • Existing methods may lack the sensitivity or precision required for advanced manufacturing processes.
  • Total reflection X-ray fluorescence (TXRF) and vapor phase decomposition (VPD) are powerful analytical techniques.

Purpose of the Study:

  • To apply TXRF in combination with VPD for the sensitive analysis of trace impurities in Si wafer native oxide layers.
  • To establish and evaluate a calibration method using microdroplet standard reference wafers for accurate quantification.
  • To determine the achievable precision and confidence level of the developed analytical method.

Main Methods:

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  • Utilized Total Reflection X-ray Fluorescence (TXRF) coupled with Vapor Phase Decomposition (VPD).
  • Analyzed trace impurities present in the native oxide layer of silicon (Si) wafer surfaces.
  • Employed microdroplet standard reference wafers for the calibration of VPD/TXRF data.

Main Results:

  • Achieved detection limits down to the range of 10(8) atoms/cm(-2) for trace impurities.
  • Demonstrated that proper quantification relies on calibration with microdroplet standard reference wafers.
  • Evaluated the precision of the calibration function, confirming its suitability for high-confidence (3 sigma) quantification.

Conclusions:

  • The combined VPD/TXRF technique offers high sensitivity for trace impurity analysis on Si wafer surfaces.
  • Microdroplet standard reference wafers are essential for accurate quantification of VPD/TXRF data.
  • The method provides reliable quantification at the 3 sigma confidence level, suitable for semiconductor quality control.