The effect of washing water on bonding to etched enamel

There is current concern about bacterial contamination of dental unit waterlines. This research hypothesized that the presence of increasing concentrations of bacteria in water used to wash etched enamel would result in a corresponding decrease in both shear bond strength (SBS) and critical surface tension (gammaC) of enamel. A further hypothesis was made that there is a correlation between SBS and gammaC. The effect of 3.5 ppm iodine in the water as a bacteriostatic agent was also assessed. Five groups of 10 samples of bovine enamel were etched, washed, and a resin composite bonded to them. The control group was washed with distilled water. Another group was washed with the dilute iodine solution. The remaining three groups used a different concentration of Escherichia coli DH5alpha as follows (in cfu mL(-1)): group 1: 10(2); group 2: 10(4); group 3: 10(6). Shear bond strength data were measured on an Instron testing machine at a crosshead speed of 1 mm min(-1). Adhesion data were (MPa): control: 24.6 +/- 6.0; with iodine: 20.8 +/- 2.7; group 1: 19.8 +/- 2.7; group 2: 13.5 +/- 3.0; group 3: 13.9 +/- 3.6. The F-test yielded a highly significant difference between control group, iodine group and group 1, compared with groups 2 and 3 (P < 0.0001). Tukey's Studentized Range Test was used for pairwise comparison testing between groups. Using a Cahn dynamic contact angle analyzer and linear regression analysis, the plots of surface tension versus costheta were extrapolated to costheta = 1 to give gammaC data for the control group and groups 1-3. In all cases reasonable linearity was observed (r2 > or = 0.87). Data (mN m(-1)) were: control group: 50.8; group 1: 45.1; group 2: 43.2; group 3: 39.5. The SBS and gammaC were then plotted against each other and linear regression analysis performed. It was concluded that increasing concentrations of bacteria in wash water decreased both SBS and gammaC and that a linear correlation (R2 = 0.84) was found between the values of these two parameters.