Effect of light-emitting diode on bond strength of orthodontic brackets

The aim of this study was to evaluate the effect of light-emitting diode (LED) light curing on shear bond strength (SBS) of orthodontic brackets bonded to teeth. Light exposure of 40 seconds from a conventional halogen-based light-curing unit was used as a control. Eighty human premolars were divided into four groups of 20 each. Brackets were bonded to acid-etched teeth with Transbond XT light-cured adhesive. In the first group, the adhesive was light cured for 40 seconds with a conventional halogen unit (XL3000, 3M). In the other three groups, adhesive was cured with a commercial LED unit (Elipar FreeLight, 3M ESPE) for 10, 20, or 40 seconds. SBS of brackets was measured on a universal testing machine and recorded in megapascals. Adhesive remnant index (ARI) scores were determined after failure of brackets. Data were analyzed using analysis of variance and chi-square tests. No statistically significant differences were found among the SBS values of halogen-based light-cured (13.1 +/- 3.1 MPa) and 20- and 40-second LED-cured (13.9 +/- 4.8 MPa and 12.7 +/- 5.1 MPa) specimens (P > .05). However, 10 seconds of LED curing yielded significantly lower SBS (P < .05). No statistically significant differences were found between the ARI scores among groups. The results of this study are promising for the orthodontic application of LED-curing units, but further compatibility and physical characteristic studies of various orthodontic adhesives and clinical trials should be performed before validation.