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Temperature rise during adhesive and resin composite polymerization with various light curing sources

Bora Ozturk1, A Nilgun Ozturk, Aslihan Usumez

  • 1Department of Restorative Dentistry, Selcuk University, Faculty of Dentistry, Konya, Turkey. bozturk@selcuk.edu.tr

Operative Dentistry
|June 16, 2004
PubMed
Summary

High-energy light sources like Plasma Arc Curing and High Intensity Quartz Tungsten Halogen caused greater temperature rises during dental adhesive and composite photopolymerization than LED and Quartz Tungsten Halogen. However, all tested conditions remained below the critical 5.6°C threshold for pulpal health.

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