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Phase-field modeling of binary alloy solidification with coupled heat and solute diffusion
J C Ramirez1, C Beckermann, A Karma
1Department of Mechanical and Industrial Engineering, The University of Iowa, Iowa City, Iowa 52242, USA.
Summary
This study presents a new phase-field model for simulating microstructural pattern formation during alloy solidification. The model accurately captures dendritic growth and solute profiles, offering a computationally efficient approach.
Area of Science:
- Materials Science
- Computational Materials Science
- Thermodynamics
Background:
- Simulating microstructural pattern formation in alloy solidification is crucial for understanding material properties.
- Existing models often face challenges with computational efficiency and accurately representing interface phenomena.
- Coupled heat and solute diffusion significantly influence solidification patterns.
Purpose of the Study:
- To develop a computationally tractable phase-field model for quantitative simulation of microstructural pattern formation in dilute binary alloy solidification.
- To accurately incorporate coupled heat and solute diffusion effects.
- To validate the model against analytical solutions and experimental observations.
Main Methods:
- Development of a phase-field model in the thin-interface limit.
- Incorporation of a recently derived antitrapping current to ensure local equilibrium at the interface.
- Elimination of interface stretching and surface diffusion effects.
- Comparison with analytical solutions for 1D steady-state solidification.
- 2D simulations of thermosolutal dendritic growth.
Main Results:
- The model accurately reproduces analytical solutions for 1D steady-state solidification.
- 2D simulations demonstrate accurate modeling of microstructural evolution and solute profiles during dendritic growth.
- The model effectively handles scenarios with vanishing solutal diffusivity in the solid.
- Simulations show utility for alloys with high Lewis numbers.
Conclusions:
- The developed phase-field model provides a computationally efficient and accurate method for simulating microstructural pattern formation in alloy solidification.
- The incorporation of the antitrapping current is key to achieving accurate interface conditions and eliminating spurious effects.
- The model is well-suited for studying dendritic solidification in alloys with varying thermal and solutal diffusivities.