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Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution
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In situ speciation studies of copper in the electroplating sludge under an electric field

S-H Liu1, H Paul Wang

  • 1Department of Environmental Engineering, National Cheng Kung University, Tainan 70101, Taiwan, ROC.

Spectrochimica Acta. Part A, Molecular and Biomolecular Spectroscopy
|July 14, 2004
PubMed

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