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Related Experiment Videos

Sequential shape-and-solder-directed self-assembly of functional microsystems.

Wei Zheng1, Philippe Buhlmann, Heiko O Jacobs

  • 1Departments of Electrical and Computer Engineering and Chemistry, University of Minnesota, 200 Union Street SE, Minneapolis, MN 55455, USA.

Proceedings of the National Academy of Sciences of the United States of America
|August 20, 2004
PubMed
Summary

We developed a novel directed self-assembly technique for fabricating microsystems. This method uses shape recognition and liquid solder for rapid, high-yield assembly of semiconductor devices and passive components.

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Area of Science:

  • Materials Science
  • Electrical Engineering
  • Nanotechnology

Background:

  • Fabricating complex microsystems with active and passive components is challenging.
  • Current methods often rely on slow, serial robotic assembly.
  • Need for efficient, high-throughput methods for micro-device integration.

Purpose of the Study:

  • To demonstrate a directed self-assembly technique for fabricating packaged microsystems.
  • To integrate active semiconductor devices and passive components using this method.
  • To achieve nonrobotic, parallel assembly of hybrid microsystems.

Main Methods:

  • Utilized directed self-assembly combining geometrical shape recognition and site-specific liquid solder binding.
  • Suspended microfabricated components with complementary shapes in ethylene glycol.

Related Experiment Videos

  • Initiated self-assembly using turbulent liquid flow and sequential component addition.
  • Employed liquid solder for mechanical and electrical connections.

    • Main Results:

    • Successfully assembled 600 AlGaInP/GaAs light-emitting diode segments (200 microm chip size) with 100% yield in 2 minutes.
    • Achieved packaged light-emitting diodes with yields exceeding 97% in two self-assembly steps (4 minutes total).
    • Demonstrated high distinguishing power between components and robust electrical connections.

    Conclusions:

    • Directed self-assembly based on shape recognition and liquid solder is an effective method for microsystem fabrication.
    • This technique enables rapid, nonrobotic, parallel assembly of complex hybrid microsystems.
    • Offers a promising route for high-yield, three-dimensional integration of microelectronic components.