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Published on: May 23, 2017
Three-dimensional deformation measurement from the combination of in-plane and out-of-plane electronic speckle
Amalia Martínez1, Juan A Rayas, Ramón Rodríguez-Vera
1Centro de Investigaciones en Optica, A C, Apartado Postal 1-948, C P 37000, León, Guanajuato, Mexico. amalia@cio.mx
Abstract:
An optical setup that can be switched to produce in-plane and out-of-plane sensitivity interferometers was designed for three-dimensional deformation measuring by electronic speckle pattern interferometry. Divergent illumination is considered in the evaluation of sensitivity vectors to measure both in-plane and out-of-plane displacement components. The combination of these interferometers presents the advantage of greater sensitivity in directions u, v, and w than a typical interferometer with three illumination beams provides. The system and its basic operation are described, and results with an elastic target that is exposed to a mechanical load are reported.
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