Dimethyl methylphosphonate decomposition on Cu surfaces: supported Cu nanoclusters and films on TiO2(110)

The thermal decomposition of dimethyl methylphosphonate (DMMP), which is a simulant molecule for organophosphorus nerve agents, has been investigated on Cu clusters as well as on Cu films deposited on a TiO(2)(110) surface. Scanning tunneling microscopy studies were conducted to characterize the cluster sizes and surface morphologies of the deposited Cu clusters and films. Temperature-programmed desorption experiments demonstrated that the surface chemistry of DMMP is not sensitive to the size of the Cu clusters over the range studied in this work. DMMP reaction on an annealed 40 monolayer Cu film resulted in the desorption of H(2), methane, methyl, formaldehyde, methanol, and molecular DMMP, and reaction on the small (4.4 +/- 0.9 nm diameter, 1.8 +/- 0.6 nm height) and large (10.7 +/- 1.9 nm diameter, 4.8 +/- 1.0 nm height) Cu clusters generated similar products. Formaldehyde and methane production is believed to occur via a methoxy intermediate on the Cu surface. These products are favored on the higher coverage Cu films that completely cover the TiO(2) surface since competing reaction pathways on TiO(2) are suppressed. X-ray photoelectron spectroscopy studies showed that DMMP begins to decompose on the Cu clusters upon adsorption at room temperature and that atomic carbon, atomic phosphorus, and PO(x) remain on the surface after DMMP decomposition.