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Related Experiment Videos

Hierarchical planning for a surface mounting machine placement.

You-jiao Zeng1, Deng-ze Ma, Ye Jin

  • 1CIM Research Institute, Shanghai Jiaotong University, Shanghai 200030, China; zyj107@sjtu.edu.cn.

Journal of Zhejiang University. Science
|October 21, 2004
PubMed
Summary
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This study presents a hierarchical planning method to maximize the throughput rate of surface mounting machines (SMMs) in printed circuit board (PCB) assembly. The approach optimizes CAD data conversion, nozzle selection, feeder assignment, and placement sequencing for improved efficiency.

Area of Science:

  • Manufacturing Engineering
  • Automation and Control Systems
  • Industrial Engineering

Background:

  • Surface Mounting Machines (SMMs) in Printed Circuit Board (PCB) assembly face challenges in CAD data conversion, nozzle selection, feeder assignment, and placement sequence determination.
  • These challenges can significantly impact the overall throughput rate and efficiency of the assembly line.

Purpose of the Study:

  • To develop and present a hierarchical planning strategy to maximize the throughput rate of SMMs.
  • To address the key problems of CAD data conversion, nozzle selection, feeder assignment, and placement sequence determination.

Main Methods:

  • Implemented a CAD data conversion system for automatic generation of machine placement data from CAD files to minimize set-up time.
  • Utilized an effective nozzle selection approach to reduce nozzle changing time.

Related Experiment Videos

  • Employed an algorithm for feeder assignment to enable simultaneous picking of multiple components, minimizing picking time.
  • Applied a heuristic algorithm to determine the optimal component placement sequence, shortening pick-and-place time.

    • Main Results:

    • The hierarchical planning approach was tested on a four-head SMM.
    • Experimental results demonstrated improvements in assembly line performance through the integrated planning strategy.
    • The methods effectively addressed the identified challenges, contributing to higher throughput.

    Conclusions:

    • The presented hierarchical planning method is effective in maximizing the throughput rate of SMMs.
    • Optimizing CAD data conversion, nozzle selection, feeder assignment, and placement sequencing leads to significant efficiency gains in PCB assembly.
    • This research provides a valuable framework for enhancing SMM performance in electronics manufacturing.