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Related Experiment Videos

Perspectives on the metallic interconnects for solid oxide fuel cells.

Wei-Zhong Zhu1, Mi Yan

  • 1State Key Lab of Silicon Materials, Zhejiang University, Hangzhou 310027, China. zhuwzus@yahoo.com

Journal of Zhejiang University. Science
|November 18, 2004
PubMed
Summary

Metallic interconnects are favored for solid oxide fuel cells (SOFCs) due to lower operating temperatures. Challenges remain in minimizing contact resistance for reliable performance, with coatings and new alloys offering solutions.

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Area of Science:

  • Materials Science
  • Electrochemistry
  • Energy Conversion

Background:

  • Solid oxide fuel cells (SOFCs) require robust interconnect materials for efficient operation.
  • Lanthanum chromite ceramics, while functional at high temperatures, present drawbacks.
  • Advancements in anode-supported SOFCs enable lower operating temperatures, necessitating new interconnect materials.

Purpose of the Study:

  • To review the development of interconnect materials for SOFCs over the past two decades.
  • To highlight criteria for selecting effective interconnect materials.
  • To evaluate metallic interconnects as alternatives to ceramics.

Main Methods:

  • Review of literature on interconnect material development.
  • Analysis of criteria for interconnect material selection.

Related Experiment Videos

  • Examination of oxidation response and thermal expansion of metallic interconnects.

    • Main Results:

    • Metallic interconnects offer advantages over ceramics, especially at lower SOFC operating temperatures.
    • Oxidation and thermal expansion behaviors of prospective metallic interconnects were evaluated.
    • Minimizing contact resistance for reliable stack performance remains a significant challenge.

    Conclusions:

    • Metallic interconnects are crucial for the commercialization of SOFCs operating at reduced temperatures.
    • Cost-effective coatings and advanced metallic materials are key to overcoming current limitations.
    • Further research is needed to develop metallic interconnects with stable oxide scales and high electrical conductivity.