Deposition of cationic polymer micelles on planar SiO2 surfaces

The deposition of PS-PVPH+ polymer micelles from a pH 1 aqueous solution onto Si wafers has been studied using a simple dip-coating technique. It has been found that the rate of evaporation of the solvent and the rate of withdrawal have a considerable influence on the density and ordering of the adsorbed micelles. The highest density and degree of ordering (as judged by the 2D pair correlation function) is achieved when solvent evaporation dominates the deposition process, but a fairly homogeneous distribution of polymer micelles can be achieved over a distance of at least 3-4 mm by controlling the solvent evaporation rate and the rate of substrate withdrawal. We did not observe any significant effect of added KCl (up to 0.1 M) during the deposition process or soaking in 1 M KCl after deposition. The attachment of these micelles is quite robust, as they cannot be washed off in pH 1 water (with or without KCl) without significant mechanical assistance. However, we did find that the micelles are rather easily caused to dewet and partially aggregate under the influence of 65 degrees C water vapor.