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A microscopic view on acoustomigration.

Thorsten Hesjedal1, Jyoti Mohanty, Franz Kubat

  • 1Paul-Drude-Institut für Festkörperelektronik, Berlin, Germany. hesjedal@pdi-berlin.de

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
|November 16, 2005
PubMed
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Acoustomigration, a material transport failure in surface acoustic wave devices, was studied in-situ using scanning probe microscopy. This technique revealed how stress from acoustic waves damages metal films, causing voids and hillocks, and influences grain structure.

Area of Science:

  • Materials Science
  • Physics
  • Electrical Engineering

Background:

  • Acoustomigration is a key failure mechanism in surface acoustic wave (SAW) devices, particularly under high power.
  • Understanding material transport driven by acoustic waves is crucial for device reliability.

Purpose of the Study:

  • To investigate the in-situ mechanisms of acoustomigration in metal structures within SAW devices.
  • To correlate acoustic wavefields with material damage and topographical changes at the submicron scale.

Main Methods:

  • Utilized scanning probe microscopy techniques, specifically scanning acoustic force microscopy (SAFM).
  • Performed in-situ observation of acoustomigration during high-power loading of 900 MHz SAW test structures with aluminum electrodes on YX-LiTaO3.
  • Acquired simultaneous measurements of acoustic wavefields and surface topography.

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Main Results:

  • Confirmed that material damage, including voids and hillocks, preferentially forms in areas of high stress, aligning with model predictions.
  • Observed that the film damage mechanism is largely independent of applied power levels within the tested range.
  • Demonstrated that acoustomigration can lead to surface smoothing through lateral grain growth and grain rotation.

Conclusions:

  • In-situ scanning probe microscopy provides detailed insights into the submicron-scale grain structure dynamics during acoustomigration.
  • The study validates theoretical models linking stress concentrations to material transport and device failure.
  • Findings contribute to a deeper understanding of acoustomigration for improving SAW device longevity.