David W Mosley1, Brian Y Chow, Joseph M Jacobson
1Center for Bits and Atoms, Massachusetts Institute of Technology, Building E15-433, 20 Ames Street, Cambridge, Massachusetts 02139, USA.
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A new gold diffusion bonding method creates highly consistent, defect-free template-stripped gold (TSG) surfaces. This epoxy-free technique enhances substrate stability for surface studies.
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