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Related Experiment Videos

Real-time photodisplacement microscope for high-sensitivity simultaneous surface and subsurface inspection.

Toshihiko Nakata1, Kazushi Yoshimura, Takanori Ninomiya

  • 1Production Engineering Research Laboratory, Hitachi Ltd., Yokohama, Japan. nakata@perl.hitachi.co.jp

Applied Optics
|April 25, 2006
PubMed
Summary

A new photothermal displacement microscope achieves high-sensitivity, real-time imaging of surface and subsurface structures. This microscopy technique enables rapid, simultaneous detection of reflectivity, topography, and displacement for defect analysis.

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Area of Science:

  • Optics and Photonics
  • Materials Science
  • Microscopy

Background:

  • Traditional microscopy often struggles to simultaneously image both surface and subsurface structures with high sensitivity.
  • Characterizing subsurface defects in materials like silicon requires advanced imaging techniques.

Purpose of the Study:

  • To develop a novel photothermal displacement microscope system for practical, high-sensitivity, simultaneous real-time imaging of surface and subsurface structures.
  • To enable rapid, non-destructive inspection of materials.

Main Methods:

  • A linear region of photothermal displacement is excited using a line-focused, intensity-modulated laser beam.
  • Surface information (reflectivity, topography) and displacement are detected using a charge-coupled device sensor-based parallel heterodyne interferometer.

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  • Space-frequency multiplexing and real-time Fourier analysis are employed to separate and reproduce surface and subsurface information.

    • Main Results:

    • The system successfully achieved simultaneous real-time imaging of reflectivity, topography, and photodisplacement.
    • Subsurface lattice defects in silicon were detected with high sensitivity.
    • Remarkable imaging speed of 0.26 seconds per 256x256 pixel area was demonstrated.

    Conclusions:

    • The developed photothermal displacement microscope is effective for simultaneous hybrid surface and subsurface inspection.
    • This technology shows significant promise for non-destructive testing and various other applications requiring detailed material characterization.