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Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
Published on: July 3, 2020
Theoretical study of the interaction between selected adhesives and oxide surfaces
Thomas Krüger1, Marc Amkreutz, Peter Schiffels
1Theoretical Physics, Faculty of Science, University of Paderborn, Warburger Str. 100, 33098 Paderborn, Germany. t.krueger@phys.uni-paderborn.de
Abstract:
We investigate the competition of the various organic components of two representative adhesive systems for reactive defect sites at model surfaces of both SiO2 and Al2O3. The reaction energies of resin monomers, curing agents, and in some cases also of additional adhesion promoters with the defects are calculated. We applied a density-functional based tight-binding method including a self-consistent correction of the Mulliken charges, which has already proven to be a useful tool for computational materials science, delivering reliable structural and energetic information.
