Related Experiment Videos
Resolution limit for electron beam-induced deposition on thick substrates.
C W Hagen1, N Silvis-Cividjian, P Kruit
1Delft University of Technology, Faculty of Applied Sciences, Delft, The Netherlands. c.w.hagen@tnw.tudelft.nl
Scanning
|August 11, 2006
Summary
High-resolution electron beam-induced deposition (EBID) is achievable on thick samples, not just thin ones. This breakthrough enables 1-nm fabrication resolution on bulk-like substrates, expanding EBID applications.
Area of Science:
- Materials Science
- Nanotechnology
- Surface Science
Background:
- Electron beam-induced deposition (EBID) has achieved significant fabrication resolution, with 1 nm dots reported.
- Current high-resolution EBID results are primarily demonstrated on thin samples using transmission electron microscopes.
Purpose of the Study:
- To investigate if high resolution in EBID is achievable on thick samples.
- To demonstrate that 1 nm resolution is possible on bulk-like substrates.
Main Methods:
- Utilized Monte Carlo simulations to model electron-sample interactions.
- Determined the surface area of secondary electron emission.
- Compared deposition on thin (10 nm) and thick (1,000 nm) copper samples using a 200 keV electron beam.
Main Results:
- Deposit size near the primary beam incidence point is independent of substrate thickness.
- Achieved 1-nm resolution on thick substrates.
- Thicker substrates influence the deposit distribution tails but not the core resolution.
Conclusions:
- High-resolution EBID is not limited to thin samples.
- 1-nm fabrication resolution is attainable on thick substrates, broadening the scope of EBID technology.