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Multiscale free-space optical interconnects for intrachip global communication: motivation, analysis, and
Michael J McFadden1, Muzammil Iqbal, Thomas Dillon
1Department of Electrical and Computer Engineering, University of Delaware, Newark 19711, USA. michael.j.mcfadden@aero.org
Applied Optics
|August 17, 2006
Summary
Optical interconnects offer a solution for microchip communication bottlenecks. A novel multiscale free-space optical system demonstrates potential for high-bandwidth intrachip data transfer.
Area of Science:
- Optoelectronics
- Microfabrication
- Integrated Photonics
Background:
- Metal wire interconnects face capacity limitations in microchips at the global layer.
- System-level modeling indicates saturation of traditional interconnects, necessitating advanced solutions.
Purpose of the Study:
- To analyze free-space optical solutions for intrachip communication at the global layer.
- To design, fabricate, and validate a multiscale optical system for microchip interconnects.
Main Methods:
- A multiscale free-space optical system was designed, incorporating microlenses, etched compound slope microprisms, and a curved mirror.
- Microprisms were fabricated and integrated into an optical setup for experimental validation.
Main Results:
- The multiscale free-space system outperformed a single-scale alternative in performance metrics.
- Experimental validation confirmed the feasibility of the designed microprisms and optical setup.
Conclusions:
- The developed multiscale free-space optical system shows promise for future microchip global communication.
- This approach offers potential for high bandwidth density and configuration flexibility in next-generation microchips.
