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Related Experiment Videos

Versatile method for manipulating and contacting nanowires.

Jakob Kjelstrup-Hansen1, Søren Dohn, Dorte Nørgaard Madsen

  • 1MIC, Department of Micro and Nanotechnology, Technical University of Denmark, Kgs Lyngby.

Journal of Nanoscience and Nanotechnology
|October 10, 2006
PubMed
Summary
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This study introduces a novel, non-lithographic technique for electrical connection of nanowires using a nanowire shadow mask. This method enables versatile contacting of diverse nanostructures for microsystem applications.

Area of Science:

  • Materials Science
  • Nanotechnology
  • Electrical Engineering

Background:

  • Electrical interconnects are crucial for integrating nanostructures into functional microsystems.
  • Existing methods for nanowire contacting often involve complex lithographic processes.
  • Contacting diverse nanomaterials with varying conductances presents a significant challenge.

Purpose of the Study:

  • To develop a simple, non-lithographic method for electrically connecting nanowires.
  • To demonstrate the versatility of the method for various nanomaterials and microsystem geometries.
  • To enable the investigation of electromechanical properties of nanowires.

Main Methods:

  • Utilizing a rigid nanowire as a local shadow mask during metal contact deposition.

Related Experiment Videos

  • Applying the technique to multiwalled carbon nanotubes, para-hexaphenylene nanofibers, and indium arsenide/phosphide nanowires.
  • Extending the method for differential electrode material deposition and electromechanical characterization.

    • Main Results:

    • Successful electrical connection of diverse nanowires (carbon nanotubes, organic nanofibers, III-V nanowires) without lithography.
    • Demonstration of contacting structures with widely different conductances.
    • Adaptation of the method for fabricating devices with asymmetric electrode materials and for electromechanical measurements.

    Conclusions:

    • The presented shadow mask method offers a simple and versatile approach for nanowire electrical interconnects.
    • This technique facilitates the integration of various nanostructures into both planar and non-planar microsystems.
    • The method opens avenues for advanced studies in nanodevice characterization and fabrication.