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Multichip vertical-external-cavity surface-emitting lasers: a coherent power scaling scheme
Li Fan1, Mahmoud Fallahi, Jörg Hader
1College of Optical Sciences, University of Arizona, Tucson, Arizona 85721, USA. lifan@optics.arizona.edu
Optics Letters
|November 30, 2006
Summary
We developed a multichip vertical-external-cavity surface-emitting laser (VECSEL) to improve laser power scaling. This design distributes heat across multiple chips, significantly increasing the pump level before thermal rollover occurs.
Area of Science:
- Optics and Photonics
- Semiconductor Lasers
- Thermal Management in Lasers
Background:
- High-power semiconductor lasers are crucial for various applications.
- Thermal rollover limits the output power of conventional vertical-external-cavity surface-emitting lasers (VECSELs).
- Efficient heat dissipation is a key challenge in VECSEL power scaling.
Purpose of the Study:
- To propose and demonstrate an efficient coherent power scaling scheme for VECSELs.
- To overcome the thermal rollover limitation in high-power VECSEL operation.
- To enhance the output power of VECSELs through improved thermal management.
Main Methods:
- Development of a multichip VECSEL architecture.
- Distribution of waste heat generated in the active region across multiple VECSEL chips.
- Experimental demonstration of a two-chip VECSEL system.
Main Results:
- Significantly increased pump level at thermal rollover due to distributed heat load.
- Successful operation of a two-chip VECSEL around 970 nm.
- Achieved over 19 W of output power from the two-chip VECSEL system.
Conclusions:
- The multichip VECSEL is an effective strategy for coherent power scaling.
- This approach significantly enhances the performance and power output of VECSELs.
- The demonstrated two-chip VECSEL showcases the potential for higher power VECSEL devices.
