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Related Experiment Videos

Illumination system for wire bonding inspection.

Der-Baau Perng1, Cheng-Chuan Chou, Shu-Ming Lee

  • 1Department of Industrial Engineering and Management, National Chiao-Tung University, 1001 Ta Hsueh Road, Hsinchu 30050, Taiwan. perng@cc.nctu.edu.tw

Applied Optics
|February 7, 2007
PubMed
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A new structured lighting system effectively inspects 2D and 3D defects in gold wire bonding for integrated circuits (ICs). This advanced illumination technology improves defect detection accuracy in microelectronic manufacturing.

Area of Science:

  • Materials Science and Engineering
  • Electrical Engineering
  • Manufacturing Technology

Background:

  • Wire bonding is crucial for connecting integrated circuit (IC) chips to substrates using fine gold wires (20 micrometers in diameter).
  • Defects in wire bonding can be categorized as 2D (missed, shifted, shorted wires) or 3D (sagging wires).
  • Traditional 2D top-view imaging struggles to detect 3D defects like wire sagging.

Purpose of the Study:

  • To develop a novel lighting system for comprehensive 3D defect inspection in the wire bonding process.
  • To enable simultaneous inspection of both 2D and 3D bonding wire defects.
  • To enhance the reliability and accuracy of quality control in microelectronic assembly.

Main Methods:

  • A structured lighting system was designed and developed specifically for wire bonding inspection.

Related Experiment Videos

  • The system features independently programmable LEDs to create structured illumination patterns.
  • The system was tested for its effectiveness in identifying various bonding wire defects.

    • Main Results:

    • The devised structured lighting system successfully facilitated the inspection of both 2D and 3D bonding wire defects.
    • Experiments demonstrated the system's effectiveness in detecting defects that are challenging with conventional 2D imaging.
    • The programmable nature of the LEDs allowed for optimized illumination strategies.

    Conclusions:

    • The novel structured lighting system is an effective solution for wire bonding inspection.
    • This technology offers significant value for improving quality control in microelectronic manufacturing.
    • The system holds potential for broader applications in automated optical inspection.