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Updated: Jul 17, 2026

Chronic Implantation of Multiple Flexible Polymer Electrode Arrays

Chronic Implantation of Multiple Flexible Polymer Electrode Arrays

Published on: October 4, 2019

A low-profile three-dimensional silicon/parylene stimulating electrode array for neural prosthesis applications.

Y Yao¹, M N Gulari, S Ghimire

¹Member, IEEE, Engineering Research Center for Wireless Integrated MicroSystems, University of Michigan, Ann Arbor, MI 48109-2122 USA.

Conference Proceedings : ... Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual Conference

|February 7, 2007

Summary

This study presents a novel low-profile neural probe for brain-computer interfaces. The design reduces the implant

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Published on: November 19, 2017

Area of Science:

Neuroscience
Biomedical Engineering
Materials Science

Background:

Neural prostheses require minimally invasive and effective electrode arrays for interfacing with the central nervous system.
Current microelectrode arrays often have limitations in terms of profile height and integration complexity.

Purpose of the Study:

To describe a novel low-profile, three-dimensional silicon/parylene microelectrode array.
To enable practical neural prostheses for central nervous system applications.

Main Methods:

Development of a folded microelectrode array using silicon probes with mixed-signal CMOS circuitry.
Implementation of a low-profile structure with gold beams and silicon braces.
Utilization of an integrated silicon/parylene batch process for encapsulation.

Main Results:

Achieved a reduced overall height of the microassembled array above the cortical surface.
Demonstrated a high-yield integrated silicon/parylene batch process.
Successfully created a functional three-dimensional microelectrode array.

Conclusions:

The developed low-profile microelectrode array is a promising basis for practical neural prostheses.
The innovative design and fabrication process facilitate improved neural interfacing.
This technology has the potential to advance the field of neural engineering.