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Resin-dentin bond strength as related to different surface preparation methods
Vanthana Sattabanasuk1, Viracha Vachiramon, Fang Qian
1Department of Conservative Dentistry and Prosthodontics, Srinakharinwirot University, Bangkok, Thailand. vanthana@swu.ac.th
Journal of Dentistry
|March 3, 2007
Summary
Dentin surface preparation significantly impacts resin-dentin bond strength, with smear layer denseness being more critical than thickness. Carbide burs resulted in the lowest bond strength for both tested adhesives.
Area of Science:
- Dental Materials Science
- Adhesive Dentistry
- Biomaterials Engineering
Background:
- Dental adhesives are crucial for bonding restorative materials to tooth structure.
- Dentin surface preparation methods can influence the smear layer and topography, potentially affecting adhesion.
- Understanding these effects is vital for optimizing clinical bonding procedures.
Purpose of the Study:
- To evaluate the microtensile bond strength of OptiBond FL and Clearfil SE Bond to dentin prepared with various methods.
- To analyze the micromorphological structures of bonded dentin surfaces using scanning electron microscopy.
Main Methods:
- Human molars were prepared using six different surface treatments (SiC papers, diamond burs, carbide bur).
- Two dental adhesives (OptiBond FL, ClearSeal SE Bond) were applied to bond composite resin.
- Microtensile bond strength testing and scanning electron microscopy were performed.
Main Results:
- Statistical analysis revealed that surface preparation method affects dentin adhesion when within-tooth correlations are considered.
- Carbide bur preparation resulted in the lowest bond strength for both adhesives.
- Diamond bur preparation led to a more compact smear layer compared to SiC papers, influencing bond strength.
Conclusions:
- Dentin surface preparation critically influences smear layer characteristics and topography, thereby affecting resin-dentin bond strength.
- Smear layer denseness, rather than thickness, appears to be a more significant factor in compromising adhesive bonding efficacy, particularly for self-etch systems.