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Published on: February 11, 2020
Epitaxial silicon oxynitride layer on a 6H-SiC(0001) surface
Tetsuroh Shirasawa1, Kenjiro Hayashi, Seigi Mizuno
1Department of Molecular and Material Sciences, Kyushu University, Kasuga, Fukuoka 816-8580, Japan.
Physical Review Letters
|May 16, 2007
Summary
Researchers developed a robust silicon oxynitride (SiON) epitaxial layer on 6H-SiC. This novel material, featuring a unique hetero-double-layer structure, shows promise for advanced electronic device applications.
Area of Science:
- Materials Science
- Surface Science
- Semiconductor Physics
Background:
- Silicon carbide (SiC) is a crucial semiconductor material for high-power and high-frequency devices.
- Developing stable and high-quality epitaxial layers on SiC is essential for advanced device fabrication.
- Existing surface treatments often result in defects or instability.
Purpose of the Study:
- To synthesize and characterize a novel silicon oxynitride (SiON) epitaxial layer on a 6H-SiC(0001) surface.
- To elucidate the atomic structure and electronic properties of the newly formed SiON layer.
- To assess the potential of this epitaxial layer for future device applications.
Main Methods:
- Hydrogen-gas etching of 6H-SiC(0001) followed by annealing in a nitrogen atmosphere.
- Quantitative low-energy electron diffraction (LEED) for structural analysis.
- Scanning tunneling spectroscopy (STS) for electronic property measurements.
Main Results:
- Formation of a stable silicon oxynitride (SiON) epitaxial layer.
- Determination of a hetero-double-layer structure: silicate monolayer on silicon nitride monolayer with Si-O-Si bonds.
- Absence of dangling bonds, ensuring robustness against air exposure.
- Observation of a bulk SiO2-like band gap of approximately 9 eV via STS.
Conclusions:
- A novel, robust SiON epitaxial layer with a unique hetero-double-layer structure has been successfully synthesized on 6H-SiC.
- The absence of dangling bonds and the observed band gap indicate significant potential for electronic device applications.
- This material represents a promising advancement in SiC surface engineering and semiconductor technology.

