Degree of conversion of adhesive systems light-cured by LED and halogen light

This study evaluated the effect of blue light emitting diode (LED) and quartz tungsten halogen (QTH) on the degree of conversion (DC) of an etch-and-rinse Single Bond adhesive system (SB) and a mixture composed of primer solution and resin bond from Clearfil SE Bond self-etching adhesive system (CB) using Fourier transform infrared analysis (FTIR). Adhesives were applied to potassium bromide pellet surfaces and FTIR analyses were performed before and after photo-activation for 10 s with either LED (Freelight 1 - 400 mw/cm(2)) or QTH (XL 3000 - 630 mw/cm(2)) light-curing units (n=8). Additional FTIR spectra were obtained from photo-activated samples stored in distilled water for 1 week. The DC was calculated by comparing the spectra obtained from adhesive resins before and after photo-activation. The results were analyzed by two-way split-plot ANOVA and Tukey's test (p<0.05). Both adhesive systems exhibited low DC (%) immediately after photo-activation (SB/QTH: 18.7 +/- 3.9; SB/LED: 13.5 +/- 3.3; CF/QTH: 13.6 +/- 1.9; CF/LED: 6.1 +/- 1.0). The DC of samples light-cured with LED was lower than DC of those light-cured with QTH, immediately after light curing and after 1 week (SB/QTH: 51.3 +/- 6.6; SB/LED: 50.3 +/- 4.8; CF/QTH: 56.5 +/- 2.9; CF/LED: 49.2 +/- 4.9). The LED curing unit used to photo-activate the adhesive resins promoted lower DC than the QTH curing unit both immediately after light curing and 1 week after storage in water.