Empirical rheological model for rough or grooved bonded interfaces

Area of Science:

• Materials Science
• Solid Mechanics
• Non-Destructive Testing

Background:

• Industrial metal/adhesive/metal structural bonds rely on surface treatments like chemical, electrochemical, or mechanical methods to enhance cohesion.
• Pretreatments create surface asperities, from roughness to grooves, influencing bond strength.
• Existing rheological models in solid mechanics and non-destructive testing often neglect the adhesive's interlocking within substrate porosities.

Purpose of the Study:

• To develop an empirical rheological model that incorporates the interlocking effects of adhesives in porous metallic surfaces.
• To simplify stress and displacement conditions by introducing a characteristic parameter for average interface porosity.
• To investigate the impact of this new interface model on the behavior of ultrasonic guided modes in bonded structures.

Main Methods:

• Development of an empirical rheological model for bonded interfaces.
• Inclusion of a characteristic parameter representing average interface porosity.
• Analysis of the influence of the developed interface model on ultrasonic guided modes.

Main Results:

• The proposed model effectively accounts for adhesive interlocking within substrate porosities.
• The characteristic porosity parameter simplifies the stress and displacement jump conditions at the interface.
• The study demonstrates the significant influence of this interface model on ultrasonic guided modes.

Conclusions:

• The developed empirical rheological model provides a more accurate representation of metal/adhesive/metal bonded interfaces by including interlocking effects.
• This model offers a simplified yet effective approach to analyzing interface behavior, crucial for structural integrity.
• Understanding the influence on ultrasonic guided modes is vital for advanced non-destructive testing and structural health monitoring applications.