Electrodeposited submicron thermocouples with microsecond response times

We describe a procedure for preparing submicron scale silver-nickel thermocouples (TCs) using electrochemical step edge decoration on graphite surfaces. Each fabrication operation produced ensembles of 2-20 TCs with diameters in the 1.0 microm to 500 nm range. These "sub-mum TCs" (SMTCs) produced linear voltage versus temperature output over the range from 20 to 100 degrees C characterized by a Seebeck coefficient of 20 +/- 1 microV/degrees C, equal to the 21 microV/degrees C that is theoretically expected for a junction between these two metals. The time response of SMTCs was evaluated using two different laser-heating methods and compared with the smallest mechanically robust commercially available type J TCs. Electrochemical etching of the silver wire introduced constrictions at grain boundaries that reduced the thermal mass of the junction without altering its integrity or its overall diameter, producing a decrease of the measured rise time for SMTCs up to 96%.