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Related Concept Videos

Bonding in Metals02:32

Bonding in Metals

Metallic bonds are formed between two metal atoms. A simplified model to describe metallic bonding has been developed by Paul Drüde called the “Electron Sea Model”.
Bonding and Strength of Aggregate01:12

Bonding and Strength of Aggregate

The bond between aggregate particles and the cement matrix is significantly influenced by the shape and surface texture of the aggregates. High-strength concretes benefit from a rougher texture, which leads to stronger bonding due to greater adhesion. Angular aggregates with larger surface areas also enhance this bond. The bonding quality, however, is complex to assess as no universally accepted test exists. Good bonding is indicated when a crushed concrete specimen shows some aggregate...
Valence Bond Theory and Hybridized Orbitals02:38

Valence Bond Theory and Hybridized Orbitals

According to valence bond theory, a covalent bond results when: (1) an orbital on one atom overlaps an orbital on a second atom, and (2) the single electrons in each orbital combine to form an electron pair. The strength of a covalent bond depends on the extent of overlap of the orbitals involved. Maximum overlap is possible when the orbitals overlap on a direct line between the two nuclei.
A σ bond (single bond in a Lewis structure) is a covalent bond in which the electron density is...
Bond Dissociation Energy and Activation Energy02:13

Bond Dissociation Energy and Activation Energy

Bond energy is the energy required to break a bond homolytically. These values are usually expressed in units of kcal/mol or kJ/mol and are referred to as bond dissociation energies when given for specific bonds or average bond energies when indicated for a given type of bond over many compounds. Firstly, the bond dissociation energy for a single bond is weaker than that of a double bond, which in turn is weaker than that of a triple bond. Secondly, hydrogen forms relatively strong bonds with...
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Related Experiment Video

Updated: Jul 11, 2026

Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices
04:54

Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices

Published on: January 17, 2017

Direct bonding and beyond.

Jan Haisma1, Nico Hattu, J T C M Pulles

  • 1Louwers Glass & Ceramics Technologies, P. O. Box 27, NL-5527 ZG Hapert, The Netherlands.

Applied Optics
|September 21, 2007
PubMed
Summary

Direct bonding, a glueless technology, is suitable for far ultraviolet immersion lithography. Advanced techniques enable precise arrangement of quantum structures and 3D lab-on-a-chip components.

Area of Science:

  • Materials Science and Engineering
  • Nanotechnology
  • Semiconductor Manufacturing

Background:

  • Direct bonding is a glueless wafer bonding technology.
  • This technology conserves geometry and is suitable for ambient conditions.
  • Further advancements are needed for advanced applications.

Purpose of the Study:

  • To evaluate recent advancements in direct bonding technology.
  • To explore 'beyond direct bonding' techniques for enhanced applications.
  • To investigate the integration of direct bonding with other technologies for novel nanostructures and devices.

Main Methods:

  • Evaluations of direct bonding under ambient conditions.
  • Implementation of bond-strengthening techniques.
  • Chemical interface engineering and advanced silicon-on-insulator (SOI) technology.

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Last Updated: Jul 11, 2026

Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices
04:54

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Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
10:32

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding

Published on: January 9, 2014

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06:10

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  • Integration with nanopillar lattice structures and silicon-technological engineering.

    • Main Results:

    • Direct bonding with bond-strengthening is well-suited for far ultraviolet immersion lithography.
    • Beyond direct bonding techniques obviate dilatation mismatch issues.
    • Successful arrangement of quantum dots, wires, and planes in a transversal cascade.
    • Exploration of direct bonding's interrelationship with elasticity and plasticity.

    Conclusions:

    • Direct bonding is a versatile technology with significant potential in advanced lithography and nanotechnology.
    • Beyond direct bonding offers solutions for overcoming material mismatch challenges.
    • The integration of direct bonding with other technologies enables the creation of complex 3D nanostructures and lab-on-a-chip devices.