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Updated: Jul 10, 2026
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Chronic Implantation of Multiple Flexible Polymer Electrode Arrays
Published on: October 4, 2019
Active electrode arrays by chip embedding in a flexible silicone carrier
Mathieu Vanden Bulcke1, Kris Baert, Eric Beyne
1Interuniv. Micro Electron. Center, Leuven, Belgium. Mathieu.VandenBulcke@imec.be
Summary
A novel flexible cochlear implant design embeds silicon chips in a silicone carrier, overcoming limitations of current passive devices and all-silicon concepts for better hearing restoration.
Area of Science:
- Biomedical Engineering
- Materials Science
- Neuroprosthetics
Background:
- Current cochlear prostheses use passive designs, limiting electrode density and functionality.
- Existing all-silicon concepts lack the flexibility of silicone-based devices.
- Advanced cochlear implants require higher electrode density and integrated feedback systems.
Purpose of the Study:
- To introduce a novel concept for advanced cochlear implants.
- To address the limitations of current passive and all-silicon designs.
- To present the fabrication process and experimental validation of the new concept.
Main Methods:
- Embedding silicon chips within a flexible silicone carrier.
- Developing a hybrid fabrication process integrating active silicon components with a flexible substrate.
- Experimental testing of the prototype for performance and biocompatibility.
Main Results:
- Successful fabrication of a flexible cochlear implant prototype.
- Demonstrated compatibility of embedded silicon chips within a silicone matrix.
- Experimental data supporting the feasibility of the novel design.
Conclusions:
- The proposed silicon chip-in-silicone concept offers a flexible and high-density electrode solution for future cochlear implants.
- This approach overcomes the trade-offs between flexibility and active component integration.
- The concept is adaptable for other implantable electronic devices, such as retinal implants.
