Skin penetration of silicon dioxide microneedle arrays
Sangchae Kim1, S Shetty, D Price
1Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL 33620, USA.
Abstract:
Out-of-plane hollow silicon dioxide microneedle arrays were fabricated and investigated to determine their efficacy for transdermal applications. The fabrication process of the SiO2 microneedles is described, and mechanical fracture forces were investigated on microneedles with different geometrical dimensions. Biomechanical characterization of the microneedles was performed to specifically test for reliable stratum corneum and skin insertion by changing the regulatory parameters such as needle width and cross-section.
