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New technology for high throughput THz BioMEMS.

V Mille1, N E Bourzgui, C Vivien

  • 1Microsyst. Microfluidics & Thz Group, Lille Univ., Villeneuve d'Ascq, France.

Conference Proceedings : ... Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual Conference
|October 20, 2007
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We developed a novel polymer-on-silicon technology for high-throughput bioMEMS. This versatile platform integrates microelectronics, electromagnetics, and microfluidics for advanced biological applications.

Area of Science:

  • Biomedical Engineering
  • Materials Science
  • Microtechnology

Background:

  • High-throughput bioMEMS are crucial for advancing biological research and diagnostics.
  • Existing technologies face limitations in integrating diverse functionalities like microelectronics and microfluidics.
  • Need for robust, versatile platforms for complex biological assays and devices.

Purpose of the Study:

  • To introduce a novel polymer-on-silicon technology for high-throughput bioMEMS.
  • To demonstrate the compatibility of this technology with microelectronic processes, electromagnetic propagation, microfluidic circulation, and biological solutions.
  • To present a new deposition process utilizing a novel polymer and cold plasma technique.

Main Methods:

  • Development of a mixed-technology polymer-on-silicon platform.

Related Experiment Videos

  • Deposition of a novel polymer using a "cold" plasma technique.
  • Application of plasma-assisted wafer bonding for surface functionalization and encapsulation.

    • Main Results:

    • The proposed technology is compatible with microelectronic processes.
    • The technology supports electromagnetic propagation and microfluidic circulation.
    • Successful surface functionalization and encapsulation achieved using plasma-assisted wafer bonding.

    Conclusions:

    • The new polymer-on-silicon technology offers a versatile and compatible platform for high-throughput bioMEMS.
    • This approach enables seamless integration of microelectronics, electromagnetics, and microfluidics for biological applications.
    • The developed process facilitates advanced surface functionalization and encapsulation, paving the way for novel bioMEMS devices.