Microelectronic retinal prosthesis: III. a new method for fabrication of high-density hermetic feedthroughs

Therapeutic, electronic medical implants used in auditory, visual, functional, and behavioral neuroprosthesis often are required to maintain their function for the remaining lifetime of the implantee. This requirement presents a substantial engineering obstacle that has previously limited the practical upper quantity of electrodes, or other signal carrying channels such devices may possess. Hermetic encapsulation of any implanted electronics and the tendency of this encapsulation to leak is a well-known problem for biomedical engineers. Each "hardwired" signal required by, or elicited from, the implant must pass through the encapsulation without breaching hermeticity. The present paper describes a method of fabrication of hermetic feedthroughs (<2 x 10(-9) std cc He/s) comprising materials with superior biological compatibility characteristics and able to accommodate relatively high numbers of signal carrying channels relative to existing methods, while allowing this to occur within small areas.