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Excess adhesive flash upon bracket placement. A typodont study comparing APC PLUS and Transbond XT
David Armstrong1, Gang Shen, Peter Petocz
1Department of Orthodontics, University of Sydney, Sydney, Australia.
The Angle Orthodontist
|November 17, 2007
Summary
The APC PLUS adhesive system and Transbond XT showed no significant difference in excess adhesive flash (EAF) during orthodontic bracket bonding. Specialist experience and bonding time also did not impact EAF amounts.
Area of Science:
- Orthodontics
- Dental Materials Science
- Adhesive Technology
Background:
- Excess adhesive flash (EAF) is a common concern in orthodontic bracket bonding.
- Minimizing EAF is crucial for patient comfort and oral hygiene.
- New adhesive systems aim to improve bonding efficiency and reduce flash.
Purpose of the Study:
- To compare the amount of excess adhesive flash (EAF) between the APC PLUS adhesive system and Transbond XT.
- To investigate the influence of variables like operator experience and bonding time on EAF.
Main Methods:
- A split-mouth design was used, with 20 orthodontic specialists bonding brackets on typodonts.
- APC PLUS and Transbond XT were used on separate halves of the dentition.
- Scanning electron microscopy and image analysis were employed to quantify EAF.
Main Results:
- No statistically significant difference in EAF was found between APC PLUS and Transbond XT overall or by quadrant.
- Operator age, clinical experience, and bonding time did not significantly affect EAF levels.
Conclusions:
- The addition of a coloring agent in APC PLUS does not reduce the amount of excess adhesive around orthodontic brackets.
- Both tested adhesive systems demonstrate comparable EAF performance.