3-D analysis of semiconductor dopant distributions in a patterned structure using LEAP.

J S Moore1, K S Jones, H Kennel

  • 1Department of Materials Science and Engineering, University of Florida, P.O. Box 116130, 525 Engineering Builing, Gainesville, FL 32611, USA. jsm200@ufl.edu

Ultramicroscopy
|November 23, 2007
PubMed
Summary

This study uses 3-D atom probe tomography to analyze dopant diffusion in patterned silicon. Experimental results confirm 3-D process simulations, advancing semiconductor device analysis.

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