Search research articles

ABOUT JoVE

Overview Leadership Blog JoVE Help Center

AUTHORS

Publishing Process Editorial Board Scope & Policies Peer Review FAQ Submit

LIBRARIANS

Testimonials Subscriptions Access Resources Library Advisory Board FAQ

RESEARCH

JoVE Journal Methods Collections JoVE Encyclopedia of Experiments Archive

EDUCATION

JoVE Core JoVE Business JoVE Science Education JoVE Lab Manual Faculty Resource Center Faculty Site

Terms & Conditions of Use

Related Concept Videos

IR Spectrometers

IR Spectrometers

There are two main infrared (IR) spectrophotometers: dispersive IR spectrometers and Fourier transform infrared (FTIR) spectrometers. In a dispersive IR spectrometer, a beam of infrared radiation produced by a hot wire is divided into two parallel equal-intensity beams using mirrors. One beam passes through the sample, while another is a reference beam. The beams then move through the monochromator, which separates the radiations into a continuous spectrum of different frequencies. The...

Attenuated Total Reflectance (ATR) Infrared Spectroscopy: Overview

Attenuated Total Reflectance (ATR) Infrared Spectroscopy: Overview

Attenuated total reflectance (ATR) infrared spectroscopy is a powerful analytical technique used to study the composition of materials. It is widely employed in chemistry, materials science, forensic science, and other fields where sample characterization is required. ATR has several advantages over traditional transmission IR spectroscopy, including the requirement of little to no sample preparation and the ability to analyze a wide range of samples.
The ATR process begins by directing a beam...

Distance Measurements by Taping

Distance Measurements by Taping

Tapes are essential in surveying for accurate, durable, and short-distance measurements. Made from lightweight, nylon-coated steel, they offer flexibility and strength for rugged outdoor use. The nylon coating protects against rust and wear, extending the tape's life. Standard lengths, around 30 meters, are marked in meters and millimeters for precision.Surveyors select tapes based on site conditions and accuracy needs. Lightweight, nylon-coated tapes are commonly used for ease of handling and...

Total Internal Reflection Fluorescence Microscopy

Total Internal Reflection Fluorescence Microscopy

Total internal reflection fluorescence microscopy or TIRF is an advanced microscopic technique used to visualize fluorophores in samples close to a solid surface with a higher refractive index, such as a glass coverslip. TIRF only allows fluorophores in proximity to the solid surface to be excited. When light from a medium with a lower refractive index (such as air) hits the glass coverslip at a critical angle, the light undergoes total internal reflection stead of passing through the glass.

Electronic Distance Measuring Instruments

Electronic Distance Measuring Instruments

Electronic Distance Measuring Instruments (EDMs) are essential tools in modern surveying, offering precise distance measurements by emitting electromagnetic signals and calculating the time required for these signals to travel to a target and return. Two primary types of signals are used in EDMs — light waves and microwaves — each suited to specific environmental and distance requirements. Light-wave-based EDMs utilize either infrared or laser light, providing high accuracy over short distances...

Infrared (IR) Spectroscopy: Overview

Infrared (IR) Spectroscopy: Overview

When electromagnetic radiation passes through a material, atoms or molecules transition from a lower to a higher energy state by absorbing radiation corresponding to the energy difference between the two states. The absorption of infrared (IR) radiation causes transitions between vibrational energy levels in a molecule. Therefore, IR spectroscopy is a useful analytical tool for determining the molecular structure of molecules.
Different compounds display unique properties due to their...

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by

Same author

Exclusive Magnetic Excitation Enabled by Structured Light Illumination in a Nanoscale Mie Resonator.

ACS nano·2018

Same author

Absolute optical ranging with 200-nm resolution.

Optics letters·2009

Same author

Gas production and transport in artificial sludge depots.

Waste management (New York, N.Y.)·2002

Same author

Scanning interferometric apertureless microscopy: optical imaging at 10 angstrom resolution.

Science (New York, N.Y.)·1995

Same author

Scanning differential phase contrast optical microscope: application to surface studies.

Applied optics·1985

Same author

Acoustic microscopy in biophysics.

Advances in biological and medical physics·1980

Search research articles

Related Experiment Video

Updated: Jul 9, 2026

Tracking Infiltration Front Depth Using Time-lapse Multi-offset Gathers Collected with Array Antenna Ground Penetrating Radar

Tracking Infiltration Front Depth Using Time-lapse Multi-offset Gathers Collected with Array Antenna Ground Penetrating Radar

Published on: May 1, 2018

Measurement of trench depth by infrared interferometry.

T van Kessel, H K Wickramasinghe

|December 15, 2007

Summary

A new infrared interferometry technique precisely measures tiny, deep structures in memory chip manufacturing. This nondestructive method ensures quality control for sub-0.25-micrometer trenches, crucial for modern devices.

Area of Science:

Semiconductor Manufacturing
Metrology
Nanotechnology

Background:

Accurate measurement of high-aspect-ratio structures is vital for semiconductor device fabrication.
Current methods for measuring features like dynamic random-access memory (DRAM) trenches face limitations in precision and non-destructive capabilities.

Purpose of the Study:

To introduce and validate a novel infrared interferometry technique for measuring sub-0.25-micrometer wide and 10-micrometer deep trenches.
To demonstrate the technique's applicability in a manufacturing environment for quality control.

Main Methods:

Implementation of a novel infrared interferometry system on a manufacturing line.
Non-destructive measurement of trench dimensions, including width and depth.
Validation of measurement accuracy against established standards.

More Related Videos

Characterization of Surface Modifications by White Light Interferometry: Applications in Ion Sputtering, Laser Ablation, and Tribology Experiments

Characterization of Surface Modifications by White Light Interferometry: Applications in Ion Sputtering, Laser Ablation, and Tribology Experiments

Published on: February 27, 2013

Subsurface Defect Localization by Structured Heating Using Laser Projected Photothermal Thermography

Subsurface Defect Localization by Structured Heating Using Laser Projected Photothermal Thermography

Published on: May 15, 2017

Related Experiment Videos

Last Updated: Jul 9, 2026

Tracking Infiltration Front Depth Using Time-lapse Multi-offset Gathers Collected with Array Antenna Ground Penetrating Radar

Tracking Infiltration Front Depth Using Time-lapse Multi-offset Gathers Collected with Array Antenna Ground Penetrating Radar

Published on: May 1, 2018

Characterization of Surface Modifications by White Light Interferometry: Applications in Ion Sputtering, Laser Ablation, and Tribology Experiments

Characterization of Surface Modifications by White Light Interferometry: Applications in Ion Sputtering, Laser Ablation, and Tribology Experiments

Published on: February 27, 2013

Subsurface Defect Localization by Structured Heating Using Laser Projected Photothermal Thermography

Subsurface Defect Localization by Structured Heating Using Laser Projected Photothermal Thermography

Published on: May 15, 2017

Main Results:

The developed infrared interferometry technique successfully measured trenches with sub-0.25-micrometer widths and 10-micrometer depths.
Achieved measurement accuracy of better than 0.1 micrometer.
Demonstrated reliable performance in a real-world manufacturing setting.

Conclusions:

Infrared interferometry offers a powerful, non-destructive solution for metrology of critical dimensions in semiconductor manufacturing.
This technique enhances quality control for advanced memory devices by providing accurate measurements of high-aspect-ratio structures.